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UFSH100
Material type: UV-curable resin / photopolymer (for SLA)
UFSH100 is a UV-curable resin for SLA 3D printing with excellent high-temperature resistance. It combines strength and toughness, making it suitable for models and parts that require heat resistance in the 60–100 °C range, depending on the post-curing process. The material also provides good dimensional stability and accuracy, so it is reliable for long-term applications.
Process compatibility
Material Color
White
Material advantages
- Excellent high-temperature resistance: with appropriate thermal post-curing, HDT can reach 100–105 °C.
- Good mechanical strength: tensile strength up to 77 MPa and flexural strength up to 116 MPa.
- Good toughness: elongation at break of up to 10% and impact strength of 15–20 J/m.
- Good dimensional accuracy and stability: suitable for precision parts requiring long-term stability.
- Easy handling: simple pre- and post-processing workflow.
- Good mechanical strength: tensile strength up to 77 MPa and flexural strength up to 116 MPa.
- Good toughness: elongation at break of up to 10% and impact strength of 15–20 J/m.
- Good dimensional accuracy and stability: suitable for precision parts requiring long-term stability.
- Easy handling: simple pre- and post-processing workflow.
Material shortcomings
- Heat resistance depends on the process: achieving high HDT requires specific thermal post-curing steps; with UV curing alone, HDT is limited to 58–62 °C.
- Limited elongation: at around 10% elongation at break, it is less ductile than more flexible resins.
- Viscosity: at 300–420 cps @ 25 °C, it requires careful handling.
- Specialized thermal post-curing required: high-temperature applications need a controlled heating process.
- Limited elongation: at around 10% elongation at break, it is less ductile than more flexible resins.
- Viscosity: at 300–420 cps @ 25 °C, it requires careful handling.
- Specialized thermal post-curing required: high-temperature applications need a controlled heating process.
Recommended description
H100 is a high-temperature UV-curable resin for SLA 3D printing. It offers excellent heat resistance (HDT up to 100–105 °C with thermal post-curing) along with good strength (tensile strength up to 77 MPa, flexural strength up to 116 MPa) and moderate toughness (elongation at break up to about 10%). It provides good dimensional accuracy and stability and is easy to process. It is especially recommended for applications requiring thermal performance and reliability, such as in automotive, aerospace, lighting, power tools, consumer electronics, and orthodontic models.
Properties
| Name | |
|---|---|
| Density | ~1.15 g/cm³ @ 25 °C |
| Critical Exposure (Ec) | 10 mJ/cm² |
| Penetration Depth (Dp) | 5–6 mils |
| Layer Thickness | 0.1 mm |
| Tensile Strength | 65–77 MPa |
| Elongation at Break | 6.2–10% |
| Flexural Strength | up to 116 MPa |
| Flexural Modulus | up to 2940 MPa |
| Impact Strength (Notched) | 15–20 J/m |
| Hardness (Shore D) | ≥80 |
| HDT @ 0.455 MPa | 58–105 °C (process-dependent) |
Common applications
• Automotive
heat-resistant components and prototypes
• Aerospace
high-temperature models and parts
• Lighting
lamp housings and heat-exposed components
• Power tools
tool housings and structural parts
• Consumer electronics
enclosures for heat-generating devices
• Orthodontic models
master models and parts for dental/medical applications
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